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Northrop Grumman Sr. Principal Electronics Packaging Engineer in Manhattan Beach, California

Embark on a career putting innovative, reliable, and agile products and ideas into orbit, and beyond. Northrop Grumman has opportunities waiting for you that play a vital role in human space exploration, national defense, and scientific discovery, supporting multiple programs across the universe. With us, you'll discover a culture of curiosity and collaboration that will have you Defining Possible from the day you start. Our space systems connect and protect millions of people on earth every day, now and for the future. Explore your future and launch your career today.

Northrop Grumman Space Systems is looking for a Senior Principal Electromechanical Engineer specialized in Electronics Packaging to join the Electronics and Payloads' Product Engineering Department. The position will be located in Manhattan Beach, CA. The Product Engineering Department is an organization of 100 engineers that performs advanced electronic packaging development in support of a variety of products destined for space and air programs.

The selected candidate is responsible for mechanical design & analysis using computer-aided design (CAD), conducting packaging trades, tolerance and interference analyses, and generating drawing packages & associated electronic data. A successful candidate will be able to coordinate among multiple disciplines to balance requirements, finalize the product design, support prototype and final hardware build & test, and assist production personnel in the resolution of design or workmanship issues that arise during hardware assembly & test.

Qualifications:

Basic Qualifications:

  • A Bachelor's of Science degree in Mechanical, or Aerospace Engineering, or another STEM (Science, Technology, Engineering or Math) discipline and 9 years of engineering experience in an aerospace environment; or a STEM Master's degree and 7 years of engineering experience; or a STEM PhD. degree and 4 years of engineering experience

  • An active DoD Secret or Top Secret, and/or SCI clearance

  • Experience with electronics packaging, 3D CAD and mechanical design

  • Experience leading a team of over 5 employees

  • Experience working with different partners across organizations and programs

  • Proficiency in performing tolerance and interference analyses

Preferred Qualifications:

  • A Master's Degree in Mechanical or Aerospace Engineering

  • Experience with electronic packaging / mechanical design for airborne and space applications

  • Experience with electronics design development and sustaining spanning cradle to grave

  • Experience with PTC Creo, Intralink and Enovia software applications

  • Experience with or knowledge of analytical / FEM SW tools

  • Experience supporting bid & proposal activities

  • Proficiency with electrical design, electronics manufacturing processes and qualification activities

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.

Job Category : Engineering

21006930

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