Northrop Grumman Engineer Electromechanical 3/4 in Manhattan Beach, California
Embark on a career putting innovative, reliable, and agile products and ideas into orbit, and beyond. Northrop Grumman has opportunities waiting for you that play a vital role in human space exploration, national defense, and scientific discovery, supporting multiple programs across the universe. With us, you'll discover a culture of curiosity and collaboration that will have you Defining Possible from the day you start. Our space systems connect and protect millions of people on earth every day, now and for the future. Explore your future and launch your career today.
Northrop Grumman is looking for a Principal or Senior Principal Electromechanical Printed Circuit Board (PCB) layout designer / Engineer to join the Electronics and Payloads' Product Engineering Department. The position will be located in Manhattan Beach, CA.
The Product Engineering Department is an organization of 100 engineers that performs advanced electronic packaging development in support of a variety of products destined for space and air programs. In this role, the selected candidate will be expected to work with all engineering disciplines to incorporate their constraints into the Mentor Expedition PCB CAD database, understand and adhere to the core Product Engineering PCB design processes, ensuring others on the team understand and are compliant, develop an expert understanding of our high reliability design standards, lead PCB design reviews, help to create PCB design schedules, and become knowledgeable with our internal build specs, industry standards, and understand PCB manufacturability.
This requisition may be filled at a higher grade base on qualifications listed below.
For more Electronics and Payloads openings visit:
Unique ID: elepay
Unique ID: SOUTHBAYJOB
This requisition may be filled at either a level 3 or a level 4
Level 3: A Bachelor of Science degree in a STEM (Science, Technology, Engineering or Math) discipline and 5 years of engineering experience in an aerospace environment, or a Master's Degree in Mechanical or Aerospace Engineering and 3 years of engineering experience in an aerospace environment
Level 4: A Bachelor of Science degree in a STEM (Science, Technology, Engineering or Math) discipline and 9 years of engineering experience in an aerospace environment, or a Master's Degree in Mechanical or Aerospace Engineering and 7 years of engineering experience in an aerospace environment
The ability to obtain and maintain a DoD/SCI clearance
Experience with CAD design, engineering of electronics packaging or printed circuit boards using Mentor Graphics Expedition design flow
Experience working with different partners across organizations and programs
Good organizational and problem solving skills with an ability to adapt quickly to changing requirements
Current understanding of IPC industry standards
Familiarity with electronic parts and their specs, including high reliability Mil Standard parts
Knowledge of how PCBs are produced and a current understanding of design and manufacturability challenges
A Master's Degree in Mechanical or Aerospace Engineering
Experience with electronic packaging / mechanical design for airborne and space applications
Experience with electronics design development and sustaining spanning cradle to grave
Experience leading a team of over 5 employees
Experience supporting bid & proposal activities
An active DoD Secret or Top Secret, and/or SCI clearance
Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit www.northropgrumman.com/EEO. U.S. Citizenship is required for most positions.
Job Category : Engineering