Staff Digital Subsystems EngineerLinthicum, MD

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems Sector is searching for Digital Subsystems Engineers that are ready to use their knowledge of advanced digital technologies and engineering experience to help us develop deployable solutions for our customers. This position will be filled at the Staff Engineer level.

This person will have a technology leadership position that will span multiple roles:

  • Team Member - Working with interdisciplinary teams to develop digital electronic subsystems and allocating functionality to subsystem components

  • Leader - Providing direction and oversight to internal and external design teams developing subsystem modules and components such as Single Board Computers, SoCs, ASICs, and FPGAs

  • Innovator - Designing and modeling digital signal processing and control algorithms implemented in Embedded Processors, ASIC and FPGA technologies

  • Developer - Developing digital electronic subsystem architectures and designs that are compatible with company and industry standards

Responsibilities will include:

  • Working with System, Software, RF, Security, and Platform teams to define product architectures to meet customer requirements

  • Implementing DSP algorithms in Matlab/Python or other higher level languages

  • Creating subsystem requirement specifications and directing design engineers during development process

  • Developing integration and test plans for subsystems

  • Collaborating with design and implementation teams to ensure requirements are met on schedule and within budget

  • Monitor and participate in the development of industry standards

  • Learning, applying and driving improvement of internal engineering processes

  • Supporting managers in business capture activities as needed

Basic Qualifications:

  • Bachelor's degree with 14 years of experience, a Master's degree with 12 years of experience or a PhD with 9 years of experience in Electrical Engineering, Computer Engineering, Computer Science, or related technical fields; an additional 4 years of experience may be considered in lieu of a degree.

  • U.S Citizenship is required

  • An active DoD Secret Security Clearance is required with the ability to obtain Special Program Access (SAP) prior to start.

  • Experience and strong background in developing digital electronic subsystems

  • Domain knowledge and experience in some of the following or similar areas: Radar, Communications, Digital Signal Processing, Digital Receivers, Direct Digital Waveform Generation, Software Defined Radio, SWAP Constrained Processor, Embedded Networking

  • An active DoD Secret Security Clearance is required

Preferred Qualifications:

  • Advanced Degrees in Electrical Engineering, Computer Engineering, Computer Science, or related technical fields

  • 5+ years of technical leadership experience

  • Active DoD Top Secret Clearance or higher

  • Aerospace and Defense Experience developing digital electronic modules, circuit boards, ASICs and/or FPGAs

  • Demonstrated expertise in field (e.g. journal published, patents)

  • DoD Open Architecture and Industry Standards knowledge and experience (e.g. SOSA, VITA, IEEE)

  • Additional Domain knowledge and experience in some of the following or similar areas: EO/IR Sensors, Sonar and Acoustic Sensors, SWAP Constrained Processing, AI & ML, Multi-chip Modules, System in a Package, Hardware Emulation, Digital Twins, High Speed Interfaces or Embedded Networking

This position is contingent upon transfer of DoD Secret Clearance and Special Program Access (SAP) prior to starting.

Salary Range: $161,000 - $241,600

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit . U.S. Citizenship is required for most positions.