Principal / Sr. Principal RF Design Engineer - Mixed Signal Packaging, EMC Analysis & Design Linthicum, MD

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems (NGMS) Advanced Capabilities division is leading the development of the next generation of high-performance computing. Superconducting electronics forms the core of our technology, with a focus on energy-efficient computation using our patented superconducting digital logic technology, Reciprocal Quantum Logic (RQL). On a gate-for-gate basis, RQL consumes orders of magnitude less power than CMOS while running at significantly higher clock speeds.

The Advanced Capabilities group is seeking experienced Principal / Sr. Principal RF Design Engineers - Mixed Signal Packaging, EMC Analysis & Design to develop these technologies into high-performance computing systems. You'll work in a fast-paced team environment alongside physicists, design engineers, and superconducting foundry engineers to make these technologies a reality.

How you will contribute to the Mission:

  • Lead and/or contribute directly, working on design and analysis of signal integrity and electromagnetic effects in highly complex high frequency, high dynamic range mixed signal systems in a very collaborative and innovative research and development environment

  • Perform analytical studies of electronic systems (integrated circuits, chip-level packaging, interposers, printed circuit boards, connectors, etc.) to support design tradeoffs

  • Design and analysis activities include electromagnetic modeling (e.g. SSN, ISI, crosstalk, EMC/EMI) for packaging parasitic estimation, associated interconnect, PCBA and filters. All design, testing and verification efforts ensure simulated and measured results meet desired design targets, and continually improve simulation-measurement correlation

  • Develop new test and simulation methods as necessary to support the above activities when demands exceed the state of the art

  • Create new design strategies where possible to support functional requirements while meeting SI, PI and EM goals

  • Deep understanding of RF/EMC measurement and analysis (s-parameters, eigenmodes, TDR, FFT, IF, etc.)

  • Work closely with other domain experts performing related functional analyses (e.g. Mechanical design & analysis, circuit design & test, thermal analysis, etc.)

  • Willingness to continually expand the knowledge base of yourself and the team (e.g. examine new research, relevant papers, seek applicable methodologies in adjacent applications, etc.)

  • Coordinate related technical team activities

  • Present details of work to colleagues during design reviews

  • Create and manage work plans to meet or exceed schedule deadlines

  • Provide written and oral summaries of work performed as needed (e.g. for reports)

This position will serve on-site in Linthicum, MD or Annapolis Junction, MD.

This position can be filled at the Principal level or Sr. Principal level based on the qualifications below:

Basic Qualifications for the Principal Engineer RF Microwave Design - Mixed Signal Packaging, EMC Analysis & Design:

  • Bachelors degree in a STEM related field with 5 or more years' of relevant experience required. Masters degree and 3 years of relevant experience

  • Working knowledge of CAD/simulation tools (e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity) in support of design and analysis

  • Experience with high frequency measurement techniques in frequency and time domains for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk.

  • Understanding of electromagnetic theory, transmission line theory, network analysis, and high-speed measurement, calibration, and de-embedding techniques.

  • Knowledge of fundamental electrical engineering and circuit design principles.

  • Use of Microsoft Office tools (Word, Excel, PowerPoint) and proficiency in writing for reporting.

  • Active U.S. TS/SCI with Poly Security Clearance for which U.S. Citizenship is a requirement

Basic Qualifications for the Sr. Principal Engineer RF Microwave Design - Mixed Signal Packaging, EMC Analysis & Design:

  • Bachelors degree in a STEM related field with 9 or more years' of relevant experience required. Masters degree and 7 years of relevant experience

  • Working knowledge of CAD/simulation tools (e.g. HFSS, CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity) in support of design and analysis

  • Experience with high frequency measurement techniques in frequency and time domains for characterizing various interconnect features such as insertion loss, return loss, impedance, and crosstalk.

  • Understanding of electromagnetic theory, transmission line theory, network analysis, and high-speed measurement, calibration, and de-embedding techniques.

  • Knowledge of fundamental electrical engineering and circuit design principles.

  • Use of Microsoft Office tools (Word, Excel, PowerPoint) and proficiency in writing for reporting.

  • Active U.S. TS/SCI with Poly Security Clearance for which U.S. Citizenship is a requirement

Preferred Qualifications:

  • Ansys HFSS modeling for RF packaging effects

  • Experience with spectrum and network analyzer techniques for EMC measurements

  • Familiarity with packaging technology (e.g. ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.)

  • Familiarity with cryogenic test stands, superconductivity, mechanical CTE

Salary Range: $99,800 - $149,800

Salary Range 2: $123,800 - $185,800

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The health and safety of our employees and their families is a top priority . The company encourages employees to remain up-to-date on their COVID-19 vaccinations. U.S. Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042 https://www.saferfederalworkforce.gov/contractors/ .

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO . U.S. Citizenship is required for most positions.

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